Buy online! Accepting US, CAD, AU, NZ ($) & EU Orders (€)

Helios The Next Generation of Time of Flight TM Gige-Vision-Logo-white genicam-logo-white ToF logo See Helios Flex Full Specs See Helios2 Full Specs 1Gb/s Bandwidth, Power over Ethernet (PoE),
M8 GPIO for Trigger and Sync. Helios2 Sub-millimeter precision, up to 8.3m working distance, IP67, M12 Gigabit Ethernet, PoE and more. Helios2 3D Time of Flight (ToF) Camera Helios Flex ToF Embedded Camera Module NEW Helios2 3D Time of Flight (ToF) Camera M12 Gigabit Ethernet Sony DepthSense IMX556PLR CMOS Back-Illuminated ToF Sensor
640x480 @ 30FPS, 8.3m Max Range
High Accuracy with Sub-millimeter Precision IP67 Camera, Industrial Immunity Dirt, Dust and Water Protection,
High EMC Immunity - IEC/EN 61000-6-2 Certified 850nm Class 1 VSCELs Multi-Frequency, High Modulation Contrast. Eye Safe. 2 Helios2 Original Helios Helios The original Helios - Compact Ethernet 3D ToF Camera. Learn More Max Working Distance m
8.3 50
More Light Transmission* 2.5x Over %
*Compared to original Helios Helios Flex The original Helios Flex - 3D ToF Camera Module for the NVIDIA® Jetson TX2. Helios2 3D Time of Flight (ToF) Camera See Helios Full Specs NEW Helios2 3D Time of Flight (ToF) Camera See more below Better 3D Precision*
Helios2 3D ToF Camera front and back

Helios2 IP67 ToF Camera

Sub-millimeter precision, up to 8.3m working distance, IP67, M12 Gigabit Ethernet, PoE and more.

Helios Time Of Flight Camera

Helios ToF Camera

The original Helios – Compact Ethernet 3D ToF Camera.

Helios Flex Camera NVIDIA Jetson TX2

Helios FLEX ToF Camera

The original Helios Flex – 3D ToF Camera Module for the NVIDIA® Jetson TX2.

Discover the Industrial Helios2 Time-of-Flight Camera

Helios2 Industrial 3D Camera
Ethernet M12 Connector
Sony DepthSense 3D ToF Sensor
Helios2 8.3m working distance
3D Time Of Flight Point Cloud
Arena 3D software and Helios Camera - Easy 3D controls

Dust proof and water resistant aluminum casing. A durable camera built for harsh industrial environments. The Helios2 ToF camera is engineered for high performance operation in industrial environments. Built for demanding 24/7 environments and a variety of industrial 3D applications such as robotics, 3D inspection, and logistics, including advanced material handling, pick and place, sorting, palletization / de-palletization, volume estimation, and more. gige vision and genicam logos Helios2 Camera Front Helios2 Camera Front reveal Industrial Robustness Compact & Ruggedized The Helios2 measures 60 x 60 x 77.5mm and is built with shock and vibration resistance. No heatsinks, no fans. Industrial Immunity Designed with higher EMC standards for extreme industrial environments. Withstand stronger electromagnetic fields, higher conducted noise levels, bigger power surges, and larger electrostatic discharges. IEC/EN 61000-6-2 certified. Factory Tough Design, 24/7 Industrial Operation More Performance
Multi-frequency 850nm Class 1 VCSELs diodes produce sharper modulation contrast and have high QE (56.6%) with the IMX556 sensor allowing better depth calculations. High Performance VCSELs
The Helios2 architecture is engineered for the next generation of high-performance 3D ToF imaging, delivering sub-millimeter precision and improved accuracy compared to the previous Helios. The calibration between the VCSELs and sensor timing is enhanced resulting in more 3D detail, along with improved attention to edge detection to reduce flying pixels and overall noise. 3D calculations are done on-camera, reducing CPU load and freeing up host PC resources. Improved light transmission results in better 3D precision*, along with increased dynamic range when both bright and dark objects are in the scene. 69 x 51° FOV (*When compared to the original Helios) The 1GbE, Power Over Ethernet (PoE), M12 interface provides a secure connection to carry both data and power over the Ethernet cable. The secure M8 GPIO allows for trigger and sync. Robust Cabling Advancements in design produces a farther maximum working distance of 8.3m, along with 6 new operating distance modes, all running at 30 FPS. Farther and Faster

2.5x More Light
 IP67 Protection Raising the Bar for Superior Time of Flight gige vision and genicam logos

A Quick Look

See how the new Helios2 compares to the original Helios. Compared to the previous generation, Helios2 offers a number of feature advancements making it a true ‘factory tough’ 3D Time of Flight camera. Featuring improved ToF performance, it produces exceptional 3D depth data with sub-millimeter precision (less than 1 mm). In addition, a robust hardware design provides IP67 rated enclosure with lens protection, GigE Vision PoE and industrial M12 connector up to 100 cable length.

Helios2 3D ToF Camera front and back
 Helios2Helios
Sensor: Sony IMX556PLR Sony IMX556PLR
Resolution: 640 x 480 px, 0.3 MP 640 x 480 px, 0.3 MP
VCSEL Wavelength 850 nm, Indoors 850 nm, Indoors
Working Distance: 0.3 - 8.3 m 0.3 - 6.0 m
Precision (Depth Noise) @ 1 m: 0.7 mm1.6 mm
Accuracy up to 1.5 m± 4.0 mm± 5.0 mm
Lens Field of View: 69° x 51° 59° x 45°
# of Operating Distance Modes: 6 Modes2 Modes
Adjustable Starting Distance Point for Modes: Yes No
Dimensions:60 x 60 x 77.5 mm 55 x 55 x 77.5 mm
Weight398 g 254 g
Frame Rate: 30 FPS (All Distance Modes) 30FPS (Near Mode) , 15FPS (Far Mode)
Exposure Presets: 32
IP67 Case: YesNo
Power over Ethernet (PoE): Yes No
"Flying Pixel" Filter: Yes No
Indoor Ambient Light Filter: On-Camera & On-Sensor On-Sensor Only
Combine with other Helios Cameras? Yes Yes
Combine with Color Camera for RGB Point Cloud? Yes Yes

Factory Tough Design, 24/7 Industrial Operation

Industrial 3D Camera Helios2 IP67

The Helios2 ToF camera is engineered for high performance operation in industrial environments. Built for demanding 24/7 environments and a variety of industrial 3D applications such as robotics, 3D inspection, and logistics, including advanced material handling, pick and place, sorting, palletization / de-palletization, volume estimation, and more.

Raising the Bar for Superior Time of Flight

sub-millimetre precision,and high accuacry, 3D Time of Flight Camera

The Helios2 architecture is engineered for the next generation of high-performance 3D ToF imaging, delivering sub-millimeter precision and improved accuracy compared to the previous Helios. The calibration between the VCSELs and sensor timing is enhanced resulting in more 3D detail, along with improved attention to edge detection to reduce flying pixels and overall noise. 3D calculations are done on-camera, reducing CPU load and freeing up host PC resources.

Slide Secure M12 Connection Go the Distance The M12 Ethernet port on the Helios2 provides a secure and sturdy connection for reliable camera operations in demanding environments. Compact, easy integration, shock and vibration resistant. Simplify your setup and maintenance thanks to PoE - use the Ethernet cable to carry both data and power up to 100m cable lengths. Ethernet is engineered to protect against EMI and crosstalk in industrial environments. 100m Cable Length with PoE

Slide Sony DepthSense on Helios Camera backside-illuminated-cmos-for-banner CAPD produces a very high demodulating contrast. A high contrast ratio means more electrons are directed to the right junction, allowing for higher quality phase shift calculations. Sony’s BSI technology ensures the maximum amount of light reaches the photodiode. Traditional front-side CMOS sensors block some of the incoming light due to the placement of the wiring layer above the photodiode. Superior Depth Data Featuring Sony’s IMX556 DepthSense ToF sensor with CAPD and backside-illuminated (BSI) technology. Technologies that produce superior depth precision compared to existing ToF solutions on the market. See How ► ToF Pixel Technology CAPD Current Assisted Photonic Demodulator CMOS Technology BSI Backside Illuminated CMOS Sony DepthSense ToF CAPD Sensor Sony DepthSense on Helios Camera backside-illuminated-cmos-for-banner CAPD produces a very high demodulating contrast. A high contrast ratio means more electrons are directed to the right junction, allowing for higher quality phase shift calculations. Sony’s BSI technology ensures the maximum amount of light reaches the photodiode. Traditional front-side CMOS sensors block some of the incoming light due to the placement of the wiring layer above the photodiode.

Slide Helios-camera-icon far working range Helios2 Industrial 3D Camera 6 Modes for Maximum Control Max: 8.3m The 6 operational distance modes maximize 3D performance based on the distance range you need and comes with the ability to adjust the starting point of each mode along the entire working range of the Helios2. 0.3 - 1.25m Min: 0.3m 0.3 - 6.0m 0.3 - 5.0m 0.3 - 4.0m 0.3 - 3.0m

Interactive Helios2 Samples Files

3D Point Cloud of Plant
Helios2 Plant thumbnail

Download Full Image (JPEG, 4.3 MB)

Medium Plant
Distance of Helios2 from boxes: 1000 mm
Using “5m” Mode

Download PLY file (ZIP, 2.8 MB)

3D Point Cloud of assorted objects
Helios2 Assorted Objects thumbnail

Download Full Image (JPEG, 9.1 MB)

Assorted Wood, Plastic, Cardboard and Metal Parts
Distance of Helios2 from Plastic Box:  1000 mm
Using “5m” Mode

Download PLY file (ZIP, 7.0 MB)

3D Point Cloud of Fuirts in Plastic Box
Helios2 Fruits Plastic Box thumbnail

Download Full Image (JPEG, 3.2 MB)

Fruits in Plastic Box
Distance of Helios2 from boxes: 1000 mm
Using “5m” Mode

Download PLY file (ZIP, 889 KB)

Slide Fast On-Camera
Processing Reduce the need for expensive host system components thanks to Helios' on-camera processing. On-camera processing provides 3D coordinates, intensity, and confidence data which can produce real-time point cloud data. 3D images of PVC Pipes - Depth Image Scroll for more examples Point-cloud 3D images of cardboard boxes- Depth Image 3D images of onions - Depth Image

Fast On-Camera Processing

Reduce the need for expensive host system components thanks to Helios’ on-camera processing. On-camera processing provides range, intensity, and confidence data which can produce live point cloud data.

Point-cloud
3D images of cardboard boxes- Depth Image
Arena SDK, 3D tools logo

Easy 3D Controls

The Arena SDK includes easy to use controls for the Helios2 ToF camera. ArenaView allows for 2D and 3D views: 2D view allows one to see the intensity and depth of the scene from the camera’s perspective. 3D view displays a point cloud of the scene and allows users to manipulate the orientation in real-time. Additionally, settings can be changed in real-time such as false color overlay, depth range adjustments, out of range color settings and more.

ArenaSDK 3D controls for Helios ToF Camera

Helios Time of Flight Models

Helios2 3D Camera Time of Flight

Helios2 ToF Camera - NEW!

This Helios2 camera model (P/N: HLT003S-001) offers improved accuracy and precision compared to the original Helios. In addition, it offers IP67 protection, higher industry immunity standards, Power over Ethernet, and a farther working range of 8.3 m HLT003S: 640 x 480 at 30 FPS, IP67, Gigabit Ethernet & PoE, Working Range: up to 8.3m

Visit HLT003S Page for Detailed Specs
Helios Time-Of-Flight ToF 3D camera

Helios ToF Camera

This Helios camera model (P/N: HLS003S) is designed to be connected to a host PC running either Windows or Linux. Depth information is processed on the Helios ISP and streamed through the Gigabit Ethernet connection. HLS003S: 640 x 480 at 30 FPS, Gigabit Ethernet, Working Range: up to 6m

Visit HLS003S Page for Detailed Specs
Helios ToF Module on NVidea Jetson TX2

Helios Embedded ToF Camera Module

This Helios Embedded model (P/N: HLS003S-001ETX2US1) is designed to be connected to a NVIDIA® Jetson TX2. The Helios Embedded camera module streams raw data via a MIPI connection. Depth information is processed on the Jetson TX2 using included Arena SDK. HLS003S-001ETX2US1: 640 x 480 at 30 FPS, MIPI Connection, Working Range: up to 6m

Visit HLS003S-001ETX2 Page for Detailed Specs
Scroll Up